SMT vs. Through-Hole Assembly: Tradeoffs for Your Project
In circuit board manufacturing, selecting an assembly method is integral to the success of any project. Aligning the assembly method with the project’s requirements is paramount, whether it's a simple or complex assembly. Our insights and expertise revolve around discerning and implementing the best approach to cater to any project.
This blog compares surface mount technology (SMT) and through-hole assembly methods and outlines their strengths and limitations. The method used for assembly depends on the board's design. Selecting an assembly method based on specific needs is important rather than simply choosing between two options.
This blog will explores the SMT vs. Through-Hole Assembly while aligning with RBB's core value of "Always Better" and our unwavering commitment to providing maximum customer benefits.
At RBB, we constantly assess our manufacturing processes and seek ways to enhance each task's efficiency.